Load-lock type Sputtering System CS 200 is for Research & Development and small production applications.
Substrate transfer capability up to Ø300mm (Deposition performance up to Ø200mm). |
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Automatic multi-layered deposition by recipe control. |
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Capable of automatic substrate transfer by simply loading the substrate on to manipulator in the Load-lock chamber. |
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Cassette chamber is available with five substrates stockers inside the load-lock chamber. |
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Co-sputtering and Multi-layer deposition using multi-cathodes. |
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Bias-sputtering was available with an optional substrate Bias power supply. |
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Research & Development. |
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Small production purpose. |
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Contact us for more product information and specifications.