Dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.
Low process pressure, high-density plasma, low electron temperature are perfect for quartz glass, Pyrex, LN, LT, etc. |
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Good profile control and surface roughness. |
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Good performance of deep SiO2 etching with PR. |
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High etching rate of Quartz > 1µm/min, Pyrex > 0.8 µm/min. |
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Excellent uniformity control. |
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Cassette chamber is selectable as an option. |
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Optical Devices (Wave guide, amplifier, optical switch etc), Micro lens, Photonics, µ-TAS etc. |
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Contact us for more product information and specifications.